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Low Density Nickel Clad Aluminum Strip High Durability Good Thermal Conductivity

ZEGOTA Precision Technology Co.,LTD
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Low Density Nickel Clad Aluminum Strip High Durability Good Thermal Conductivity

Brand Name : ZEGOTA

Model Number : NCA117

Certification : ISO9001:2008 , IATF/TS16949:2016 , ISO14001:2004 , CNAS

Place of Origin : China

MOQ : Negotiable

Product name : Nickel clad aluminum

Material : Nickel + aluminum + Nickel

Application : Aerospace industry , 3C industry,optical instrument

Feature : Ultra thin (super thin) High combination rate Perfect surface

Function : Lightweight Fast heat dissipation High thermostability

Shape : Strip , coil , sheet

Price : Negotiable

Packaging Details : Thin Film, Rustproof Paper

Delivery Time : 10-15 Days

Payment Terms : 100% T/T Before Shipment

Supply Ability : 100000 Tons Per Year

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High bonding rate lightweight nickel clad aluminum clad nickel with high temperature resistance

Nickel clad aluminum belongs to the combination of rare metals and non-ferrous metals. The advantages of nickel and aluminum are combined to form a lightweight, corrosion resistant and high temperature resistant clad material. ZEGOTA uses innovative technology, high-end equipment and high-quality raw materials to develop and produce high-quality nickel clad aluminum with high combination rate, ultra-thin and good surface quality.

Advantages:

1. Lightweight: Aluminum, as the base material, can greatly improve the quality characteristics of materials and achieve superior balance in strength and weight.

2. Fast heat dissipation: Nickel-aluminium composite has the advantages of low thermal expansion coefficient, low density and fast heat dissipation.

Parameters:

Clad material Nickel Aluminum Aluminum
Aluminum Nickel Nickel
Nickel / /
Thickness(mm) 0.01-4.0 0.04-4.0 0.01-4.0
Width(mm) 5.0-1500 5.0-1500 5.0-1500

Tensile strength

(Mpa)

230-300 260-320 300-350

Yield strength

(Mpa)

180-240 200-260 260-300
Elongation(%) ≥40 ≥37 ≥15

Application:

Nickel-aluminium composites are suitable for the manufacture of electronic devices such as lining materials and radiators because of their low thermal expansion coefficient, low density and good thermal conductivity.


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